93AA76A_06 Datasheet, PDF (19/28 Pages) Microchip Technology – 8K Microwire Compatible Serial EEPROM

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
e
n
b
α
c
D
2
1
ϕ
A
β
L
A1
A2
Units
Dimension Limits MIN
INCHES
NOM
MAX
MILLIMETERS*
MIN
NOM
MAX
Number of Pins
Pitch
n
8
e
.026 BSC
8
0.65 BSC
Overall Height
A
Molded Package Thickness
A2
–
–
.047
–
–
1.20
.031
.039
.041
0.80
1.00
1.05
Standoff
Overall Width
A1
.002
–
.006
0.05
–
0.15
E
.252 BSC
6.40 BSC
Molded Package Width
E1
.169
.173
.177
4.30
4.40
4.50
Molded Package Length
D
.114
.118
.122
2.90
3.00
3.10
Foot Length
Foot Angle
L
.018
.024
.030
0.45
0.60
0.75
ϕ
0°
–
8°
0°
–
8°
Lead Thickness
c
.004
–
.008
0.09
–
0.20
Lead Width
Mold Draft Angle Top
b
.007
–
.012
0.19
–
0.30
α
12° REF
12° REF
Mold Draft Angle Bottom
β
12° REF
12° REF
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086
Revised 7-25-06
© 2006 Microchip Technology Inc.
DS21796H-page 19