MCP6041T-I Datasheet, PDF (17/40 Pages) Microchip Technology – 600 nA, Rail-to-Rail Input/Output Op Amps

MCP6041/2/3/4
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
5-Lead SOT-23 (MCP6041)
Example:
XXNN
Device
I-Temp
Code
E-Temp
Code
MCP6041/T-E/OT
SPNN
7XNN
Note:
Parts with date codes prior to
November 2012 have their package
markings in the SBNN format.
7X25
6-Lead SOT-23 (MCP6043)
Example:
XXNN
Device
MCP6043T-E/CH
I-Temp
Code
SCNN
E-Temp
Code
SDNN
SC25
8-Lead MSOP
XXXXXX
YWWNNN
Example:
6043I
304256
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Example:
MCP6041
I/P256
OR
1304
MCP6041
I/P e3256
1304
Example:
MCP6042
I/SN1304
256
MCP6042I
OR ^{SN e3 1304}
256
Legend:
XX...X
Y
YY
WW
NeN3N
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2001-2013 Microchip Technology Inc.
DS21669D-page 17