DSPIC30F2012-30I Datasheet, PDF (150/210 Pages) Microchip Technology – High-Performance, 16-bit Digital Signal Controllers

dsPIC30F2011/2012/3012/3013
20.1 DC Characteristics
TABLE 20-1: OPERATING MIPS VS. VOLTAGE
VDD Range
Temp Range
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
Max MIPS
dsPIC30FXXX-30I
30
—
20
—
10
dsPIC30FXXX-20E
—
20
—
15
—
TABLE 20-2: THERMAL OPERATING CONDITIONS
Rating
dsPIC30F201x-30I
dsPIC30F301x-30I
Operating Junction Temperature Range
Operating Ambient Temperature Range
dsPIC30F201x-20E
dsPIC30F301x-20E
Symbol Min
TJ
-40
TA
-40
Typ Max Unit
—
+125
°C
—
+85
°C
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD × (IDD – ∑ IOH)
I/O Pin power dissipation:
PI/O = ∑ ({VDD – VOH}× IOH ) + ∑ (_VOL _{× I} OL)
Maximum Allowed Power Dissipation
TJ
-40
—
+150
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ - TA) / θJA
W
TABLE 20-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 18-pin PDIP (P)
θJA
44
—
°C/W
1
Package Thermal Resistance, 18-pin SOIC (SO)
θJA
57
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP (SP)
θJA
42
—
°C/W
1
Package Thermal Resistance, 28-pin (SOIC)
θJA
49
—
°C/W
1
Package Thermal Resistance, 44-pin QFN
θJA
28
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
DS70139G-page 150
© 2010 Microchip Technology Inc.