MCP37211-200 Datasheet, PDF (135/142 Pages) Microchip Technology – Power-Saving Modes

MCP37211-200 AND MCP37D11-200
121-Ball Thin Fine Pitch Ball Grid Array (TE) - 8x8 mm Body [TFBGA]
System In Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
D
A
B
2X
0.15 C
2X
0.15 C
C
SEATING
PLANE
A2
A1
E
(DATUM B)
(DATUM A)
TOP VIEW
SIDE VIEW
D1
eD
0.10 C
A
0.10 C
A1 BALL PAD CORNER
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11
BOTTOM VIEW
eE
E1
DETAIL A
Microchip Technology Drawing C04-212A Sheet 1 of 2
 2014-2016 Microchip Technology Inc.
DS20005355C-page 135