SIO1007 Datasheet, PDF (103/108 Pages) Microchip Technology – LPC Super I/O LPC IrDA Hot Docking Chip with UART

SIO1007
22.0 PACKAGE OUTLINE
Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging.
FIGURE 22-1:
64-PIN STQFP PACKAGE
Min
Nominal
Max
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
1.40
1.45
D
8.80
9.00
9.20
D1
6.80
7.00
7.20
E
8.80
9.00
9.20
E1
6.80
7.00
7.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00 REF.
~
e
0.40 Basic

0^o
~
7^o
W
0.13
0.18
0.23
ccc
~
~
0.08
Remarks
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
Note 1: Controlling Unit: millimeter.
2: Tolerance on the true position of the leads is ± 0.035 mm maximum.
3: Package body dimensions D1 and E1 do not include the mold protrusion.
4: Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.
5: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
6: Details of pin 1 identifier are optional but must be located within the zone indicated.
 2005 - 2015 Microchip Technology Inc.
DS00002020A-page 103