MDWC0340EB Datasheet, PDF (5/6 Pages) MagnaChip Semiconductor. – Common-Drain Dual N-Channel Trench MOSFET 12V, 13.6A, 2.5 m(ohm)

Package Dimension
MDWC0340EB WLCSP POD(Package Outline Dimension)
Contents
Chip Thickness (Min. / Typ. / Max.)
Metal (Gate PAD)
Metal (Source PAD)
Passivation Layer
Chip Size
Gate Pad Open Size
Packaging
Value
110 / 140 / 190 ㎛
Al-Cu-Si
Cu/Ni/Au
Yes
3,540±40 ×1,770±40 ㎛ ²
Ø250 ㎛
5,000 pcs / 1 reel
Dec. 2016. Rev 1.0
5
MagnaChip Semiconductor Ltd.