MLX90819 Datasheet, PDF (9/11 Pages) Melexis Microelectronic Systems – Relative Integrated Pressure Sensor Datasheet

MLX90819
Datasheet
MLX90819 in SENT mode
2.2nF
SENTOut
(TX)
Vdd
47nF
Gnd
Figure 5: MLX90819 application schematic - SENT
12. Die Dimensions
The MLX90819 shall be delivered as bare die, on fully tested wafers. Each wafer is accompanied by a wafer map in order to
discriminate between good and bad die during customer assembly. The die dimensions (including scribe lane), membrane
size are depicted in Figure 6. All dimensions are in mm.
TYP
0 .780
Die Dimension excluding scribe lane
TYP < 0.1
Die Dimension including scribe lane (after dicing)
2 . 555
± 0.05
TYP 0.55
TYP < 0.1
2.555 ± 0.05
0.8
±0.08
1.09
±0.08
1 .05
± 0.05
TYP 0.5
Figure 6: Floorplan of a single die, including central position of membrane
REVISION 3 – OCTOBER 20, 2016
3901090819
Page 9 of 11