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| MLX90819 Datasheet, PDF (5/11 Pages) Melexis Microelectronic Systems – Relative Integrated Pressure Sensor Datasheet | |||
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MLX90819
Datasheet
6. Glossary of Terms
Bar
Pressure unit (1bar = 100kPa)
ADC
Analog to Digital Converter
DAC
Digital tVoDAnDalog Converter
TX
DSP
Digital Signal Processor
TEST
EMC
Electro Magnetic Compatibility
FSO
Full Span Output
SENT
Single Edge Nibble Transmission
VDD
TX
TEST
Table 2: Glossary of terms
7. Bond Pads Location and Description
The positions of the bond pads are shown ErSroNr! Reference source not found. in Figure 3. The (X, Y) axeSsNare depicted in
blue; they represent the basis of the CartesiaSnPcoordinates oGf tNheDbonOd UpaTds center points.
SP
GND OUT
VDD
TX
TEST
VDD
TX
TEST
Y
(0,0)
SN
SP X
GND OUT
Figure 3: Bond Pads Location
2650
The bond pad coordinates and their names and functional type are given in table 3.
SN
SP
GND OUT
2650
REVISION 3 â OCTOBER 20, 2016
3901090819
Page 5 of 11
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