MAX16930 Datasheet, PDF (2/29 Pages) Maxim Integrated Products – 2MHz, 36V, Dual Buck with Preboost and 20μA Quiescent Current

MAX16930/MAX16931
2MHz, 36V, Dual Buck with Preboost and
20µA Quiescent Current
ABSOLUTE MAXIMUM RATINGS
IN, INS, CS3P, CS3N, FB3, EN1, EN2,
EN3, TERM to PGND_........................................-0.3V to +42V
CS1, CS2, OUT1, OUT2 to AGND.........................-0.3V to +11V
CS1 to OUT1.........................................................-0.2V to +0.2V
CS2 to OUT2.........................................................-0.2V to +0.2V
CS3P to CS3N.......................................................-0.2V to +0.2V
BIAS, FSYNC, FOSC to AGND..............................-0.3V to +6.0V
COMP1, COMP2, BSTON to AGND......................-0.3V to +6.0V
FB1, FB2, FSELBST, EXTVCC to AGND...............-0.3V to +6.0V
DL_ to PGND_ ......................................................-0.3V to +6.0V
BST_ to LX_ .........................................................-0.3V to + 6.0V
DH_ to LX_...........................................................-0.3V to + 6.0V
LX_ to PGND_........................................................-0.3V to +42V
PGND_ to AGND...................................................-0.3V to +0.3V
PGOOD1, PGOOD2 to AGND..............................-0.3V to +6.0V
Continuous Power Dissipation (T_A = +70NC)
TQFN (derate 35.7mW/NC above +70NC)..................2857mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature Range...........................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (q_JA)...........28°C/W
Junction-to-Case Thermal Resistance (q_JC)...............1.7°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_IN = 14V, V_BIAS = 5V, C_BIAS = 6.8μF, T_A = T_J = -40NC to +125NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
SYNCHRONOUS STEP-DOWN DC-DC CONVERTERS
Normal operation
Supply Voltage Range
t < 1s
V_IN
With preboost after initial startup condition
is satisfied
Supply Current
V_EN1 = V_EN2 = V_EN3 = 0V
V_EN1 = 5V, V_OUT1 = 5V, V_EN2 = V_EN3 =
0V, V_EXTVCC = 5V, no switching
I_IN
V_EN2 = 5V, V_OUT2 = 3.3V, V_EN1 = V_EN3 =
0V, V_EXTVCC = 3.3V, no switching
V_EN1 = V_EN2 = 5V, V_OUT1 = 5V, V_OUT2 =
3.3V, V_EN3 = 0V, V_EXTVCC = 3.3V,
no switching
Buck 1 Fixed Output Voltage
Buck 2 Fixed Output Voltage
Output Voltage Adjustable
Range
V_OUT1
V_OUT2
V_FB1 = V_BIAS, PWM mode
V_FB1 = V_BIAS, skip mode
V_FB2 = V_BIAS, PWM mode
V_FB2 = V_BIAS, skip mode
Buck 1, buck 2
MIN
3.5
2.0
4.95
4.95
3.234
3.234
1
TYP
8
30
20
25
5
5
3.3
3.3
MAX
36
42
36
20
40
30
40
5.05
5.075
3.366
3.4
10
UNIT
V
FA
V
V
V
Maxim Integrated
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