MAX15039_11 Datasheet, PDF (2/19 Pages) Maxim Integrated Products – 6A, 2MHz Step-Down Regulator with Integrated Switches Open-Drain, Power-Good Output

6A, 2MHz Step-Down Regulator
with Integrated Switches
ABSOLUTE MAXIMUM RATINGS
IN, PWRGD to GND..................................................-0.3V to +6V
V_DD to GND ..................-0.3V to the lower of +4V or (V_IN + 0.3V)
COMP, FB, MODE, REFIN, CTL1, CTL2, SS,
FREQ to GND ..........................................-0.3V to (V_DD + 0.3V)
OUT, EN to GND ......................................................-0.3V to +6V
BST to LX..................................................................-0.3V to +6V
BST to GND ............................................................-0.3V to +12V
PGND to GND .......................................................-0.3V to +0.3V
LX to PGND ..................-0.3V to the lower of +6V or (V_IN + 0.3V)
LX to PGND ..........-1V to the lower of +6V or (V_IN + 1V) for 50ns
I_LX(RMS) (Note 1) ......................................................................6A
V_DD Output Short-Circuit Duration .............................Continuous
Converter Output Short-Circuit Duration ....................Continuous
Continuous Power Dissipation (T_A = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (θ_JA) ............36°C/W
Junction-to-Case Resistance (θ_JC).................................6°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V_IN = V_EN = 5V, C_VDD = 2.2µF, T_A = T_J = -40°C to +85°C, typical values are at T_A = +25°C, circuit of Figure 1, unless otherwise
noted.) (Note 3)
PARAMETER
IN
IN Voltage Range
IN Supply Current
Total Shutdown Current from IN
3.3V LDO (V_DD)
V_DD Undervoltage Lockout
Threshold
V_DD Output Voltage
V_DD Dropout
V_DD Current Limit
BST
BST Supply Current
PWM COMPARATOR
CONDITIONS
f_S = 1MHz, no load
V_IN = 5V, V_EN = 0V
V_IN = V_DD = 3.3V, V_EN = 0V
V_IN = 3.3V
V_IN = 5V
LX starts/stops switching
V_IN = 5V, I_VDD = 0 to 10mA
V_IN = 2.9V, I_VDD = 10mA
V_IN = 5V, V_DD = 0V
V_DD rising
V_DD falling
Minimum glitch-width
rejection
V_BST = V_IN = 5V, V_LX = 0 or 5V, V_EN = 0V
MIN
2.9
2.35
3.1
25
TYP MAX UNITS
5.5
V
4.9
8
mA
5.2
8.5
10
20
µA
45
2.6
2.8
V
2.55
10
µs
3.3
3.5
V
0.08
V
40
mA
0.025
µA
PWM Comparator Propagation
Delay
10mV overdrive
20
ns
PWM Peak-to-Peak Ramp
Amplitude
PWM Valley Amplitude
1
V
0.8
V
2 _______________________________________________________________________________________