MAX14500 Datasheet, PDF (2/41 Pages) Maxim Integrated Products – Hi-Speed USB-to-SD Card Readers with Bypass

Hi-Speed USB-to-SD Card
Readers with Bypass
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V_CC ...........................................................................-0.3V to +4V
V_SD ...........................................................................-0.3V to +4V
V_IO ............................................................................-0.3V to +4V
V_TM ...........................................................................-0.3V to +4V
KVBUS......................................................................-0.3V to +4V
CLDO........................................................................-0.3V to +2V
CDAT1_[3:0], HDAT1_[3:0], CCMD1, HCMD1, CCLK1, HCLK1,
CCRD_PRST, HCRD_PRST, CDAT2_[3:0], HDAT2_[3:0],
CCMD2, HCMD2, CCLK2, HCLK2 .........-0.3V to (V_SD + 0.3V)
BUSY, BERR/INT, MODE, SCL, SDA, I2C_SEL,
ADD, RST.................................................-0.3V to (V_IO + 0.3V)
CD+, CD-, HD+, HD-, RREF, FREF ............-0.3V to (V_TM + 0.3V)
Continuous Power Dissipation (T_A = +70°C)
40-Pin TQFN (derate 35.7mW/°C above +70°C) ........2857mW
Junction-to-Case Thermal Resistance (θ_JC) (Note 1)
40-Pin TQFN ................................................................1.7°C/W
Junction-to-Ambient Thermal Resistance (θ_JA) (Note 1)
40-Pin TQFN .................................................................28°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V_CC = +2.4V to +3.6V, V_SD = +2.4V to +3.6V, V_IO = +1.5V to +3.6V, V_TM = +2.91V to +3.4V, T_A = -40°C to +85°C, unless otherwise
noted. Typical values are at V_CC = +3.3V, V_IO = +2.5V, V_SD = +2.5V, V_TM = +3.3V, T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
DC CHARACTERISTICS
Pass thru
2.1
3.6
V_CC Supply Voltage
V_CC Card reader active, f_{CCLK_} ≤ 26MHz
2.1
Card reader active, f_{CCLK_} > 26MHz
2.4
Pass thru
2.0
3.6
V
3.6
3.6
V_SD Supply Voltage
Logic Interface Supply Voltage
USB Supply Voltage
V_SD Card reader active, f_{CCLK_} ≤ 26MHz
Card reader active, f_{CCLK_} > 26MHz
V_IO
V_TM
2.0
2.4
1.5
2.91
3.6
V
3.6
3.6
V
3.4
V
Digital Core LDO Regulator
Output Voltage
V_CLDO C_CLDO = 1.0µF
1.8
V
V_CC Supply Current
Pass thru
I_CC
Card reader active
5
15
µA
35
50
mA
V_SD Supply Current
Pass thru
I_SD
Card reader active
17
40
µA
3
mA
V_IO Supply Current
Pass thru
I_IO
Card reader active
2
10
µA
0.2
mA
V_TM Supply Current
Pass thru
I_TM
Card reader active
13
50
µA
25
mA
V_SD Comparator Threshold
V_TM Comparator Threshold
MODE, I2C_SEL, ADD, RST
Input-Voltage Low
V_SDCT
V_TMCT
V_IL
1.0
1.5
1.9
V
2.0
2.5
2.9
V
0.4
V
2 _______________________________________________________________________________________