MAX1304_11 Datasheet, PDF (2/37 Pages) Maxim Integrated Products – 8-/4-/2-Channel, 12-Bit, Simultaneous-Sampling ADCs with ±10V, ±5V

8-/4-/2-Channel, 12-Bit, Simultaneous-Sampling ADCs
with ±10V, ±5V, and 0 to +5V Analog Input Ranges
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND.........................................................-0.3V to +6V
DVDD to DGND ........................................................-0.3V to +6V
AGND to DGND.....................................................-0.3V to +0.3V
CH0–CH7, I.C. to AGND (MAX1304/MAX1305/MAX1306)....±6V
CH0–CH7, I.C. to AGND (MAX1308/MAX1309/MAX1310)..±16.5V
CH0–CH7, I.C. to AGND (MAX1312/MAX1313/MAX1314)..±16.5V
D0–D11 to DGND ...................................-0.3V to (V_DVDD + 0.3V)
EOC, EOLC, RD, WR, CS to DGND .......-0.3V to (V_DVDD + 0.3V)
CONVST, CLK, SHDN, CHSHDN to DGND -0.3V to (V_DVDD + 0.3V)
INTCLK/EXTCLK to AGND .....................-0.3V to (V_AVDD + 0.3V)
REF_MS, REF, MSV to AGND ...................-0.3V to (V_AVDD + 0.3V)
REF+, COM, REF- to AGND ...................-0.3V to (V_AVDD + 0.3V)
Maximum Current into Any Pin Except AVDD, DVDD, AGND,
DGND ...........................................................................±50mA
Continuous Power Dissipation (T_A = +70°C)
LQFP (derate 22.7mW/°C above +70°C) ................1818.2mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V_AVDD = +5V, V_DVDD = +3V, V_AGND = V_DGND = 0V, V_REF = V_REFMS = +2.5V (external reference), C_REF = C_REFMS = 0.1µF, C_REF+ =
C_REF- = 0.1µF, C_REF+-to-REF- = 2.2µF || 0.1µF, C_COM = 2.2µF || 0.1µF, C_MSV = 2.2µF || 0.1µF (unipolar devices), MSV = AGND (bipo-
lar devices), f_CLK = 16.67MHz 50% duty cycle, INTCLK/EXTCLK = AGND (external clock), SHDN = DGND, T_A = T_MIN to T_MAX,
unless otherwise noted. Typical values are at T_A = +25°C. See Figures 3 and 4.)
PARAMETER
SYMBOL
CONDITIONS
STATIC PERFORMANCE (Note 1)
Resolution
N
Integral Nonlinearity
INL (Note 2)
Differential Nonlinearity
DNL No missing codes (Note 2)
Offset Error
Unipolar, 0x000 to 0x001
Bipolar, 0xFFF to 0x000
Offset-Error Matching
Unipolar, between all channels
Bipolar, between all channels
Offset-Error Temperature Drift
Unipolar, 0x000 to 0x001
Bipolar, 0xFFF to 0x000
Gain Error
Gain-Error Matching
Between all channels
Gain-Error Temperature Drift
DYNAMIC PERFORMANCE at f_IN = 500kHz, A_IN = -0.4dBFS (Note 2)
Signal-to-Noise Ratio
SNR
Signal-to-Noise Plus Distortion
SINAD
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
Channel-to-Channel Isolation
ANALOG INPUTS (CH0 through CH7)
MAX1304/MAX1305/MAX1306
Input Voltage
V_CH MAX1308/MAX1309/MAX1310
MAX1312/MAX1313/MAX1314
MIN TYP MAX UNITS
12
Bits
±0.5 ±1.0 LSB
±0.3 ±0.9 LSB
±3
±16
LSB
±3
±16
±9
±20
LSB
±9
±20
7
ppm/°C
7
±2
±16 LSB
±3
±14 LSB
4
ppm/°C
68
71
dB
68
71
dB
-86
-80
dBc
84
dBc
80
86
dB
0
+5
-5
+5
V
-10
+10
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