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MAX11606_11 Datasheet, PDF (2/22 Pages) Maxim Integrated Products – Low-Power, 4-/8-/12-Channel, I2C, 10-Bit ADCs in Ultra-Small Packages
Low-Power, 4-/8-/12-Channel, I2C,
10-Bit ADCs in Ultra-Small Packages
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V
AIN0–AIN11,
REF to GND ............-0.3V to the lower of (VDD + 0.3V) and 6V
SDA, SCL to GND.....................................................-0.3V to +6V
Maximum Current into Any Pin .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
8-Pin µMAX (derate 5.9mW/°C above +70°C) ..........470.6mW
12-Pin WLP (derate 16.1mW/°C above +70°C) .........1288mW
16-Pin QSOP (derate 8.3mW/°C above +70°C)........666.7mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX11607/MAX11609/MAX11611), VDD = 4.5V to 5.5V (MAX11606/MAX11608/MAX11610), VREF = 2.048V
(MAX11607/MAX11609/MAX11611), VREF = 4.096V (MAX11606/MAX11608/MAX11610), fSCL = 1.7MHz, TA = TMIN to TMAX, unless other-
wise noted. Typical values are at TA = +25°C. See Tables 1–5 for programming notation.) (Note 1)
PARAMETER
DC ACCURACY (Note 2)
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Offset-Error Temperature
Coefficient
Gain Error
Gain-Temperature Coefficient
Channel-to-Channel Offset
Matching
SYMBOL
CONDITIONS
INL
DNL
(Note 3)
No missing codes over temperature
Relative to FSR
(Note 4)
Relative to FSR
MIN TYP MAX UNITS
10
Bits
±1
LSB
±1
LSB
±1
LSB
0.3
ppm/°C
±1
LSB
0.3
ppm/°C
±0.1
LSB
Channel-to-Channel Gain
Matching
±0.1
LSB
DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)
Signal-to-Noise Plus Distortion
SINAD
60
dB
Total Harmonic Distortion
THD Up to the 5th harmonic
-70
dB
Spurious Free Dynamic Range
SFDR
70
dB
Full-Power Bandwidth
SINAD > 57dB
3.0
MHz
Full-Linear Bandwidth
-3dB point
5.0
MHz
CONVERSION RATE
Conversion Time (Note 5)
tCONV
Internal clock
External clock
6.8
µs
10.6
Internal clock, SCAN[1:0] = 01
53
Throughput Rate
Track/Hold Acquisition Time
fSAMPLE
Internal clock, SCAN[1:0] = 00
CS[3:0] = 1011 (MAX11610/MAX11611)
External clock
53
94.4
800
ksps
ns
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