DS1308 Datasheet, PDF (2/16 Pages) Dallas Semiconductor – 64 X 8 Serial Real Time Clock

DS1308
Low-Current I²C RTC with 56-Byte NV RAM
ABSOLUTE MAXIMUM RATINGS
(All voltages relative to ground.)
Voltage Range on V_CC or V_BAT............................-0.3V to +6.0V
Voltage on Any Non-Power Pin................. -0.3V to (V_CC + 0.3V)
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature Maximum......................................+150NC
Storage Temperature Range............................. -55NC to +125NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
FSOP
Junction-to-Ambient Thermal Resistance (B_JA)......206.3NC/W
Junction-to-Case Thermal Resistance (B_JC)................42NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED OPERATING CONDITIONS
(T_A = -40NC to +85NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
DS1308-18
Operating Voltage Range
V_CC DS1308-3
DS1308-33
Battery Voltage
V_BAT
Logic 1 Input
V_IH
Logic 0 Input
V_IL
MIN
1.71
2.7
3.0
1.3
0.7 x
V_CC
-0.3
TYP MAX UNITS
1.8
5.5
3.0
5.5
V
3.3
5.5
5.5
V
V_CC +
0.3
V
0.3 x
V_CC
V
DC ELECTRICAL CHARACTERISTICS
(V_CC = V_CCMIN to V_CCMAX, V_BAT = V_BATMIN to V_BATMAX, T_A = -40NC to +85NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
Power-Supply Active Current
(Note 3)
I_CCA -3 or -33: f_SCL = 400kHz
325
Power-Supply Standby Current
(Note 4)
Battery Leakage Current
Input Leakage (SCL)
I/O Leakage (SDA, SQW/CLKIN)
Output Logic 0 (SDA, SQW/
CLKIN), V_OL = 0.4V
Power-Fail Trip Point
Switchover Voltage
I_CCS
I_BATLKG
I_I
I_IO
I_OL
V_PF
V_SW
-33: V_CC = 3.63V
V_CC = V_CCMAX
V_CC R V_PF
V_IN = 0V to V_CC
I²C bus inactive, ECLK = 1
V_CC R V_CCMIN
V_BAT R 1.3V R V_CC + 0.2V
-33
V_BAT > V_PF
V_BAT < V_PF
125
200
-100
25
+100
-0.1
+0.1
-0.1
+0.1
3.0
250
2.70 2.82 3.00
V_PF
V_BAT > V_CC
UNITS
FA
FA
nA
FA
FA
mA
FA
V
V
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