DS1347_13 Datasheet, PDF (16/17 Pages) Maxim Integrated Products – Low-Current, SPI-Compatible Real-Time Clock

DS1347
Low-Current, SPI-Compatible
Real-Time Clock
GUARD RING
*
**
GROUND PLANE
VIA CONNECTION
*
V_CC PLANE
VIA CONNECTION
0.1µF
SM CAP
*
**
*
SM WATCH CRYSTAL
*
*
GROUND PLANE
VIA CONNECTION
*
*
*
*
**
**LAYER 2 LOCAL GROUND PLANE
CONNECT ONLY TO PIN 4
GROUND PLANE VIA
**
GROUND PLANE
VIA CONNECTION
*
*^{LAYER 1 TRACE}
Figure 4. Crystal PCB Layout
PROCESS: CMOS
Chip Information
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
8 TDFN-EP
PACKAGE
CODE
T833+2
OUTLINE
LAND
NO. PATTERN NO.
21-0137
90-0059
16
Maxim Integrated