DS1340_11 Datasheet, PDF (14/16 Pages) Maxim Integrated Products – I2C RTC with Trickle Charger

I²C RTC with Trickle Charger
Handling, PC Board Layout,
and Assembly
The DS1340C package contains a quartz tuning-fork
crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Exposure to reflow is limited to 2
times maximum. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
Moisture-sensitive packages are shipped from the facto-
ry dry-packed.Handling instructions listed on the pack-
age label must be followed to prevent damage during
reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
TOP VIEW
X1 1
X2 2
V_BACKUP 3
GND 4
DS1340
8 V_CC
7 FT/OUT
6 SCL
5 SDA
SO, μSOP
Pin Configurations
SCL ₁
FT/OUT 2
V_CC 3
N.C. 4
N.C. 5
N.C. 6
N.C. 7
N.C. 8
DS1340C
16 SDA
15 GND
14 V_BACKUP
13 N.C.
12 N.C.
11 N.C.
10 N.C.
9 N.C.
SO (300 mils)
Chip Information
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Thermal Information
Theta-JA: 170°C/W (0.150in SO)
Theta-JC: 40°C/W (0.150in SO)
Theta-JA: 221°C/W (µSOP)
Theta-JC: 39°C/W (µSOP)
Theta-JA: 89.6°C/W (0.300in SO)
Theta-JC: 24.8°C/W (0.300in SO)
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
LAND
OUTLINE NO. _{PATTERN NO.}
8 SO (150 mils) S8+2
21-0041
90-0096
8 µSOP
U8+1
21-0036
90-0092
16 SO (300 mils) W16#H2
21-0042
90-0107
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