DS1340_06 Datasheet, PDF (13/14 Pages) Maxim Integrated Products – I2C RTC with Trickle Charger

I²C RTC with Trickle Charger
Handling, PC Board
Layout, and Assembly
The DS1340C package contains a quartz tuning-fork
crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Exposure to reflow is limited to 2
times maximum. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
The leaded 16-pin SO package may be reflowed as
long as the peak temperature does not exceed 240°C.
Peak reflow temperature (≥ 230°C) duration should not
exceed 10 seconds, and the total time above 200°C
should not exceed 40 seconds (30 seconds nominal).
The RoHS and lead-free/RoHS packages may be
reflowed using a reflow profile that complies with
JEDEC J-STD-020.
Moisture-sensitive packages are shipped from the facto-
ry dry-packed.Handling instructions listed on the pack-
age label must be followed to prevent damage during
reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
TOP VIEW
X1 1
X2 2
V_BACKUP 3
GND 4
DS1340
8 V_CC
7 FT/OUT
6 SCL
5 SDA
SO, µSOP
Pin Configurations
SCL ₁
FT/OUT 2
V_CC 3
N.C. 4
N.C. 5
N.C. 6
N.C. 7
N.C. 8
DS1340C
16 SDA
15 GND
14 V_BACKUP
13 N.C.
12 N.C.
11 N.C.
10 N.C.
9 N.C.
SO (300 mils)
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