MA02303GJ_1 Datasheet, PDF (5/7 Pages) Tyco Electronics – RF Power Amplifier IC For 2.5 GHz ISM

RF Power Amplifier IC
For 2.5 GHz ISM
Mechanical Data
MA02303GJ
V7
Figure 11 Component layout and printed circuit drawing for evaluation board (60 mil GETEK board).
Application Information
+V_DD
RF_IN
T1
C1
C2
C3
T7
1
R1
T2
T3
2
L1
3
T4
4
C4
3
T8
8
7
6
5
L2
RF_OUT
T5
T6
C5
C6
Full-Downset Paddle
To Board Ground
Figure 12 Evaluation Board Schematic
List of Components
Discrete Components
C1 – C4 = 100 pF multilayer ceramic chip capacitor (Dielectric Labs C11AH101K5TXL)
C5 = 2.0 pF multilayer ceramic chip capacitor (Dielectric Labs C11AH2R0BTXL)
C6 = 1.2 pF multilayer ceramic chip capacitor (Dielectric Labs C11AH1R2B5TXL)
R1 = 300 Ω chip resistor (P300ECT-ND)
L1 = 1.8 nH chip inductor (Toko TKS235CT-ND)
L2 = 27 nH chip inductor (Coilcraft 1008CS-270XKBB)
Transmission Line Lengths*
T1 = 0.15"
T2 = 0.21"
T3 = 0.11" (Not very critical)
T4 = 0.16"
T5 = 0.13"
T6 = 0.16"
T7 = 0.13" (Not very critical)
T8 = 0.077" (Not very critical)
T1, T2, T3, T5, T6 are 0.077" wide
T4, T7, and T8 are 0.026" wide
*The board material is 0.060" FR-4 (distance is between RF and GND) with a dielectric constant of about 4.3 (standard FR-4)
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