MRF275G Datasheet, PDF (3/16 Pages) Motorola, Inc – 150 W, 28 V, 500 MHz N.CHANNEL MOS BROADBAND 100 - 500 MHz RF POWER FET

+VGG
C14
B1
A
B
C17
C18
L6
+28 V
L5
+
C19
R1
C15
C16
C22
C1
Z1
C2
C5
C3
Z2
C4
L1
D.U.T.
Z3
Z5
C6
Z4
Z6
L2
L3
C10
Z7
C11
C7 C8
C9
B2
C12
Z8
C13
L4
A
C20
B
C21
B1
B2
C1, C2, C3, C4,
C10, C11, C12, C13
C5, C8
C6
C7
C9
C14, C15, C16,
C20, C21, C22
C17, C18
C19
L1, L2
L3, L4
Balun, 50 Ω, 0.086″ O.D. 2″ Long, Semi Rigid Coax
Balun, 50 Ω, Coax 0.141″ O.D. 2″ Long, Semi Rigid
270 pF, ATC Chip Capacitor
1.0 – 20 pF, Trimmer Capacitor, Johanson
22 pF, Mini–Unelco Capacitor
15 pF, Unelco Capacitor
2.1 pF, ATC Chip Capacitor
0.1 µF, Ceramic Capacitor
680 pF, Feedthru Capacitor
10 µF, 50 V, Electrolytic Capacitor, Tantalum
10 Turns AWG #24,
0.145″ O.D., 106 nH
Taylor–Spring Inductor
10 Turns AWG #18,
0.340″ I.D., Enameled Wire
L5
L6
R1
W1 – W4
Z1, Z2
Z3, Z4, Z5, Z6
Z7, Z8
Ferroxcube VK200 20/4B
4 Turns #16, 0.340″ I.D.,
Enameled Wire
1.0 kΩ,1/4 W Resistor
20 x 200 x 250 mils, Wear Pads,
Beryllium–Copper, (See
Component Location Diagram)
1.10″ x 0.245″, Microstrip Line
0.300″ x 0.245″, Microstrip Line
1.00″ x 0.245″, Microstrip Line
Board material
0.060″ Teflon–fiberglass,
ε_r = 2.55, copper clad both sides, 2 oz. copper.
Points A are connected together on PCB.
Points B are connected together on PCB.
Figure 1. 500 MHz Test Circuit
REV 1
3