XP1026-BD_15 Datasheet, PDF (8/13 Pages) M/A-COM Technology Solutions, Inc. – Power Amplifier

XP1026-BD
Power Amplifier
27.0-32.0 GHz
Mechanical Drawing
0.82
(0.032)
2.00
(0.079)
2
1.22
1.62
(0.048) (0.064)
3
4
2.42
2.82
3.22
(0.095) (0.111) (0.127)
5
6
7
Rev. V1
1.00
(0.039)
1
8
1.00
(0.039)
0.0
0.0
14
13
12
11
10
9
0.82
1.22
1.62
(0.032) (0.048) (0.064)
2.42
2.82
(0.095) (0.111)
(Note: Engineering designator is 30SPA0553)
3.22
(0.127)
3.70
(0.146)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
Most DCBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFand Vd3 Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:4.588 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RFOut)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Bias Arrangement (See App Notes [1], [2] and [3])
Vg1
Vg3
Vg2
2
3
4
5
6
7
RF In 1
8 RF Out
14
13
12
11
10
9
Vd1
Vd2
Vd3
Layout for reference only – It is recommended to bias
output stage from both sides.
8
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