XP1026-BD_15 Datasheet, PDF (11/13 Pages) M/A-COM Technology Solutions, Inc. – Power Amplifier

XP1026-BD
Power Amplifier
27.0-32.0 GHz
App Note [3] Material Stack-Up – In addition to the practical aspects of bias and bias
arrangement, device base material stack-up also must be considered for best thermal per-
formance. A well thought out thermal path solution will improve overall device reliability,
RF performance and power added efficiency. The photo shows a typical high power ampli-
fier carrier assembly. The material stack-up for this carrier is shown below. This stack-up
is highly recommended for most reliable performance however, other materials (i.e. eutec-
tic solder vs epoxy, copper tungsten/copper moly rib, etc.) can be considered/possibly
used but only after careful review of material thermal properties, material availability and
end application performance requirements.
MMIC, 4mil
Diemat DM6030HKEpoxy, ~1mil
MOLYRib, 5mil, Au plated
Alumina Subst rate
AuSn Eutect ic Solder
Copper Block
MOLYCarrier, 25mil
Au plat ed
Rev. V1
11
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support