MA4SW210B-310B_15 Datasheet, PDF (7/7 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon PIN Diode Switches

MA4SW210B-1
MA4SW310B-1
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
MA4SW310B-1
Chip Outline^1,2 & Dimensions
Rev. V4
Notes:
1. Topside and backside metallization is gold , 2.5µm
thick typical.
2. Yellow areas indicate wire bonding pads
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.071 0.072 1.807
1.833
B
0.071 0.072 1.797
1.823
C
0.0045 0.0055 0.100
0.150
D
0.031 0.032 0.781
0.807
E
0.029 0.030 0.732
0.758
F
0.006 0.007 0.152
0.178
G
0.004
0.005 0.099
0.125
H
0.005 0.006 0.125
0.151
J
0.034
0.035 0.871
0.897
K
0.064 0.065 1.617
1.643
L
0.066 0.067 1.683
1.709
M
0.005
REF. 0.1250
REF.
N
0.0046 REF. 0.1180 REF.
Ordering Information
Part Number
MA4SW210B-1
MA4SW310B-1
Package
Gel Pack
Gel Pack
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
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