MA4SW210B-310B_15 Datasheet, PDF (1/7 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon PIN Diode Switches

MA4SW210B-1
MA4SW310B-1
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V4
Features
♦ Broad Bandwidth Specified 2 to 18 GHz
♦ Usable up to 26 GHz
♦ Integrated Bias Network
♦ Low Insertion Loss / High Isolation
♦ Fully Monolithic Construction
♦ Glass Encapsulate
♦ Polymer Protective Coating
♦ RoHS Compliant
Description
The MA4SW210B-1 and MA4SW310B-1
devices are SP2T and SP3T broadband
switches with an integrated bias networks
utilizing
M/A-COM Technology Solutions
HMIC^TM (Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310. This
process allows the incorporation of silicon
pedestals that form series and shunt diodes or
vias by imbedding them in low loss, low
dispersion glass. By using small spacing
between circuit elements, this combination
of silicon and glass gives HMIC devices low
loss and high isolation performance with
exceptional repeatability through low millimeter
frequencies.
Large bond pads facilitate the use of low
inductance ribbon bonds, while full area, gold,
backside metallization allows for manual or
automatic chip bonding via 80Au/20Sn solders
or electrically conductive silver epoxy.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF C.W. Incident Power
Bias Current +25°C
Absolute Maximum
-65^oC to +125^oC
-65^oC to +150^oC
+175^oC
- 50V
+30dBm C.W.
± 20mA
Max. operating conditions for a combination of
RF power, D.C. bias and temperature:
+30dBm CW @ 15mA (per diode) @+85°C
MA4SW210B-1
MA4SW310B-1
Yellow areas indicate bond pads
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
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information contained herein without notice.