MA4SW210B-310B_15 Datasheet, PDF (6/7 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon PIN Diode Switches

MA4SW210B-1
MA4SW310B-1
HMIC™ Silicon PIN Diode Switches
with Integrated Bias Network
Rev. V4
Wire Bonding
Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150^oC and a force of 18 to 22 grams should be used. If
ultrasonic energy is necessary, it should be adjusted to the minimum level required to achieve a good
bond. RF bond wires should be kept as short as possible.
Chip Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder
preform or conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work
surface temperature of 255^oC and a tool tip temperature of 265^oC. When hot gas is applied, the
temperature at the chip should be 290^oC. The chip should not be exposed to temperatures greater than
320^oC for more than 20 seconds. No more than three seconds should be required for attachment.
Solders rich in tin should not be used.
Epoxy Die Attachment: A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A
thin epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per
product instructions. Typically 150°C for 1 hour.
MA4SW210B-1
Chip Outline^1,2 & Dimensions
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.066
0.070
1.680
1.780
B
0.048
0.052
1.230
1.330
C
0.004
0.006
0.100
0.150
D
0.004
0.006
0.090
0.140
E
0.012
0.013
0.292
0.317
F
0.029
0.030
0.735
0.760
G
0.030
0.031
0.766
0.791
H
0.029
0.030
0.732
0.757
J
0.005
REF.
0.129
REF.
K
0.005
REF.
0.129
REF.
Notes:
1. Topside and backside metallization is gold ,
2.5µm thick typical.
2. Yellow areas indicate wire bonding pads
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
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