MA4SW424B_15 Datasheet, PDF (6/6 Pages) M/A-COM Technology Solutions, Inc. – SP4T 24GHz PIN Diode Switch with Integrated Bias Network

MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Rev. V1
Cleanliness
Assembly Considerations
These chips should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MA4SW424B-1 PIN diode switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures
must be followed.
Wire Bonding
Thermo-compression wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150^oC and a force of 18 to 22 grams should be used. If ultrasonic
energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires
should be kept as short as possible.
Chip Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with conductive silver epoxy. Mounting
surface must be clean and flat. A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin
epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product
instructions. Typically 150°C for 1 hour.
Ordering Information
Part Number
MA4SW424B-1
Packaging
Die in Waffle Pack
6
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.