MA4SW424B_15 Datasheet, PDF (1/6 Pages) M/A-COM Technology Solutions, Inc. – SP4T 24GHz PIN Diode Switch with Integrated Bias Network

MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Features
♦ Frequency of Operation: 24 +/- 2 GHz
♦ Fully Integrated Bias Network
♦ Low Power Consumption
+12mA for Insertion Loss, 0V for Isolation
♦ The Device is Wire Bond Compensated at all RF
Ports for RF Matching
♦ Rugged, Monolithic, Glass Encapsulated
Construction
♦ RoHS Compliant
Rev. V1
Description
The MA4SW424B-1 is a SP4T switch with an
integrated bias network which utilizes M/A-COM
Technology Solutions HMIC^TM (Heterolithic
Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation
of silicon pedestals that form series and/or shunt
diodes or vias by imbedding them in a low loss,
low dispersion glass. By using small spacing
between elements, this combination of silicon
and glass gives HMIC devices exceptional low
loss and high isolation performance with
exceptional repeatability through lower millimeter
frequencies. Five, 4.5 X 5.5 mil, RF bond pads
facilitate the use of low inductance ribbon bonds,
while gold backside metallization allows for
manual or automatic chip bonding using
electrically conductive silver epoxy. Each RF
bond pad has an adjacent tuning pad. The user
can use bias and add the appropriate wire or
ribbon (inductance) to optimize the RF match and
performance for the particular frequency of
interest.
Applications
The MA4SW424B-1 SP4T, switch is designed for
24 GHz automotive switching applications.
Insertion loss is achieved with +12 mA @ +4 V and
isolation is achieved with 0V D.C. bias. The RF
bias network is integrated into the HMIC switch for
ease of use and space considerations.
Gold bond pads are shown here in yellow.
Absolute Maximum Ratings¹
Parameter
Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
RF Incident Power @ +20mA
Absolute Maximum
+40mA
-55°C to +125°C
-55°C to +150°C
+175°C
30 dBm
1. Exceeding any of these limits may cause permanent
damage to the chip.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.