MA4SW424B_15 Datasheet, PDF (5/6 Pages) M/A-COM Technology Solutions, Inc. – SP4T 24GHz PIN Diode Switch with Integrated Bias Network

MA4SW424B-1
SP4T 24GHz PIN Diode Switch with Integrated Bias Network
Chip Dimensions
H
I
H
G
G
Rev. V1
A
F
E
D
C
C
B
Dimension
A
B
C
D
E
F
G
H
I
Mils
Min
Max
100
104
131
135
61
62
27
28
64
65
91
92
25
26
52
52
19
20
Millimeters
Min
Max
2.54
2.64
3.33
3.43
1.55
1.57
0.70
0.72
1.63
1.65
2.31
2.33
0.63
0.65
1.31
1.33
0.48
0.50
Notes:
1. All RF (J) bond pads are 4.5 X 5.5 mils (0.177 X .217 mm).
2. All DC (B) bond pads are 4.0 X 5.5 mils (0.157 X .217 mm).
3. Chip thickness 5 mils (.127 mm)
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: [phone] • Europe Tel: [phone]
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.