L130-2780002011001 Datasheet, PDF (8/24 Pages) Lumileds Lighting Company – Hot targeted leading lm/$ QFN with superior lumen maintenance

Solder Pad Design
Figure 3. Solder pad layout.
Notes for Figure 3:
1. All dimensions are in millimeters.
2. The drawing above shows the recommend solder pad layout on the Printed Circuit Board (PCB).
3. Application Brief AB209 provides details for this layout. In addition, the .drawing files are available at www.philipslumileds.com and www.philipslumileds.cn.com.
Package Information
Table 6. Package Information for L130-xx80002011001
Material/Component
Lead Frame Base
Package Body
Encapsulate
Weight
Notes for Table 6:
1. All dimensions are in millimeters.
2. Tolerance ± 0.10mm.
Specification
Copper Alloy
High Temperature Thermal Plastic
Silicone Resin, with Phosphor
0.01 gram
LUXEON 3020 Datasheet DS209 20140320 ©2014 Philips Lumileds Lighting Company.
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