LTC3851-1_15 Datasheet, PDF (27/28 Pages) Linear Technology – Synchronous Step-Down Switching Regulator Controller

LTC3851-1
PACKAGE DESCRIPTION
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev A)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 p 0.102
2.845 p 0.102
(.112 p .004)
0.889 p 0.127
(.112 p .004)
(.035 p .005)
1
8
0.35
REF
5.23
(.206)
MIN
1.651 p 0.102 3.20 – 3.45
(.065 p .004) (.126 – .136)
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.651 p 0.102
(.065 p .004)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
16
9
4.039 p 0.102
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
(.159 p .004)
(NOTE 3)
0.280 p 0.076
16151413121110 9 (.011 p .003)
REF
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0o – 6o TYP
4.90 p 0.152
(.193 p .006)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.18
(.007)
0.53 p 0.152
(.021 p .006)
DETAIL “A”
1.10
(.043)
MAX
12345678
0.86
(.034)
REF
SEATING
PLANE _{0.17 – 0.27}
0.1016 p 0.0508
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
(.007 – .011)
TYP
0.50
(.0197)
BSC
(.004 p .002)
MSOP (MSE16) 0608 REV A
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3.50 p 0.05
1.45 p 0.05
2.10 p 0.05 (4 SIDES)
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 p0.05
3.00 p 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 p 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 s 45o CHAMFER
0.40 p 0.10
1
1.45 p 0.10
2
(4-SIDES)
PACKAGE
OUTLINE
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.200 REF
0.00 – 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(UD16) QFN 0904
0.25 p 0.05
0.50 BSC
38511fa
27