LTC3834 Datasheet, PDF (27/28 Pages) Linear Technology – 30μA IQ Synchronous Step-Down Controller

LTC3834
PACKAGE DESCRIPTION
3.86
(.152)
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
20 1918 17 16 15 14 1312 11
6.60 p0.10
4.50 p0.10
SEE NOTE 4
2.74
(.108)
0.45 p0.05
1.05 p0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0o – 8o
2.74
(.108)
6.40
(.252)
BSC
1 2 3 4 5 6 7 8 9 10
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE20 (CB) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
4.50 p 0.05 1.50 REF
3.10 p 0.05
2.65 p 0.05
3.65 p 0.05
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
0.70 p0.05
4.00 p 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 p 0.05
R = 0.05 TYP
1.50 REF
19 20
5.00 p 0.10
(2 SIDES)
PACKAGE
OUTLINE
2.50 REF
3.65 p 0.10
2.65 p 0.10
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
0.40 p 0.10
1
2
0.25 p0.05
0.50 BSC
2.50 REF
4.10 p 0.05
5.50 p 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.200 REF
0.00 – 0.05
(UFD20) QFN 0506 REV B
R = 0.115
TYP
0.25 p 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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