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LTC3770_15 Datasheet, PDF (22/24 Pages) Linear Technology – Fast No RSENSE Step-Down Synchronous Controller with Margining, Tracking and PLL
LTC3770
APPLICATIONS INFORMATION
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller.
• Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to
the source of M2.
• Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
• Connect the input capacitor(s) CIN close to the power
MOSFETs. This capacitor carries the MOSFET AC
current.
• Keep the high dV/dt SW, BOOST and TG nodes away
from sensitive small-signal nodes.
• Connect the INTVCC decoupling capacitor CVCC closely
to the INTVCC and PGND pins.
• Connect the top driver boost capacitor CB closely to
the BOOST and SW pins.
• Connect the VIN pin decoupling capacitor CIN closely
to the VIN and PGND pins.
TYPICAL APPLICATIONS
1.8V/5A at 450kHz with Tracking
RPG
100k
PGOOD
RUN
CF
220pF
FCB
R7
47k
32 31 30 29 28 27 26 25
RRUN
R8
51k
51k
PGOOD VON RUN FCB Z0 BOOST TG SW
R2 RC
60.4k 10k
R1
CC2
30.1k 100pF
1 VRNG
2 VFB
3 ITH
4
SGND
5
MARGIN1
MARGIN1
6
MARGIN0
MARGIN0
7
ION
RON
75k
8
VREFIN
LTC3770EUH
SENSE+ 24
SENSE– 23
PGND 22
BG 21
DRVCC 20
INTVCC 19
18
Z2
Z1 17
CC1
1000pF
R5
10k
VREFOUT MPGM TRACK/SS PLLFLTR PLLIN VIN VINSNS ZVIN
9
10
11
12
13 14 15 16
TRACK/SS
R6
VCC
200k
5V
CIN: TDK C4532X5R1H685M
COUT: PANASONIC EEFUE0G181R
L1: BI TECH 1.8μH HM65-H1R8-TB
M1, M2: PHILIPS PH3230
M1
PH3230
VIN
4V TO 28V
1000pF
CB
0.22μF
L1
1.8μH
VOUT
1.8V
5A
DB
D1
CMDSH-3 B340A
M2
PH3230
INTVCC
CVCC
4.7μF
+ COUT
180μF
4V
x2
COUT3
22μF
X5R
x2
CIN
6.8μF
50V
x3
3770 TA02a
3770fc
22