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LTC3784_15 Datasheet, PDF (18/38 Pages) Linear Technology – 60V PolyPhase Synchronous Boost Controller
LTC3784
Applications Information
the upper range of low current operation. In Burst Mode
operation, lower inductance values will cause the burst
frequency to decrease. Once the value of L is known, an
inductor with low DCR and low core losses should be
selected.
Power MOSFET Selection
Two external power MOSFETs must be selected for each
controller in the LTC3784: one N-channel MOSFET for the
bottom (main) switch, and one N-channel MOSFET for the
top (synchronous) switch.
The peak-to-peak gate drive levels are set by the INTVCC
voltage. This voltage is typically 5.4V during start-up
(see EXTVCC pin connection). Consequently, logic-level
threshold MOSFETs must be used in most applications.
Pay close attention to the BVDSS specification for the
MOSFETs as well; many of the logic level MOSFETs are
limited to 30V or less.
Selection criteria for the power MOSFETs include the
on-resistance RDS(ON), Miller capacitance CMILLER, input
voltage and maximum output current. Miller capacitance,
CMILLER, can be approximated from the gate charge curve
usually provided on the MOSFET manufacturer’s data
sheet. CMILLER is equal to the increase in gate charge
along the horizontal axis while the curve is approximately
flat divided by the specified change in VDS. This result
is then multiplied by the ratio of the application applied
VDS to the gate charge curve specified VDS. When the IC
is operating in continuous mode, the duty cycles for the
top and bottom MOSFETs are given by:
Main Switch Duty Cycle = VOUT − VIN
VOUT
Synchronous Switch Duty Cycle = VIN
VOUT
If the maximum output current is IOUT(MAX) and each chan-
nel takes one half of the total output current, the MOSFET
power dissipations in each channel at maximum output
current are given by:
PMAIN
=
(VOUT
− VIN)VOUT
V2 IN
⎛
• ⎝⎜
IOUT(MAX)
2
⎞
⎠⎟
2
•(1+ δ)
• RDS(ON) + k • VOUT3
• IOUT(MAX)
2 • VIN
• CMILLER • f
PSYNC
=
VIN
VOUT
⎛
• ⎝⎜
IOUT(MAX)
2
⎞
⎠⎟
2
•(1+ δ) •RDS(ON)
where d is the temperature dependency of RDS(ON) (ap-
proximately 1Ω). The constant k, which accounts for
the loss caused by reverse recovery current, is inversely
proportional to the gate drive current and has an empirical
value of 1.7.
Both MOSFETs have I2R losses while the bottom N-channel
equation includes an additional term for transition losses,
which are highest at low input voltages. For high VIN the
high current efficiency generally improves with larger
MOSFETs, while for low VIN the transition losses rapidly
increase to the point that the use of a higher RDS(ON) device
with lower CMILLER actually provides higher efficiency. The
synchronous MOSFET losses are greatest at high input
voltage when the bottom switch duty factor is low or dur-
ing overvoltage when the synchronous switch is on close
to 100% of the period.
The term (1+ d) is generally given for a MOSFET in the
form of a normalized RDS(ON) vs Temperature curve, but
d = 0.005/°C can be used as an approximation for low
voltage MOSFETs.
18
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