LTC3260_15 Datasheet, PDF (15/18 Pages) Linear Technology – Low Noise Dual Supply Inverting Charge Pump

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3260
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
0.70 ±0.05
4.00 ±0.10
(2 SIDES)
8
R = 0.05
TYP
R = 0.115
TYP
0.40 ±0.10
14
3.60 ±0.05
2.20 ±0.05
3.30 ±0.05
1.70 ±0.05
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 REF
0.25 ±0.05
0.50 BSC
0.200 REF
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
3.30 ±0.10
1.70 ±0.10
7
3.00 REF
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(DE14) DFN 0806 REV B
1
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.00 – 0.05 _{BOTTOM VIEW—EXPOSED PAD}
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3260fa
15