PIM400 Datasheet, PDF (15/20 Pages) Lineage Power Corporation – -36 to -75 Vdc; 400W/10A

GE
PIM400 Series; ATCA Board Power Input Modules
-36 to -75 Vdc; 400W/10A
Data Sheet
Layout Considerations
The power modules are low profile in order to be used in fine
pitch system card architectures. As such, component
clearance between the bottom of the power module and the
mounting board is limited. Avoid placing copper areas on the
outer layer directly underneath the power module. Also avoid
placing via interconnects underneath the power module.
Particular attention should be paid to the clearance area as
noted in the Bottom View of the Mechanical Outline drawing.
For additional layout guidelines, refer to FLT012A0Z Data Sheet.
Process Considerations
Through-Hole Lead-Free Soldering Information
The RoHS-compliant, Z version, through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. The module is designed to be processed through
single or dual wave soldering machines. The pins have a RoHS-
compliant, pure tin finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process.
Max. sustain temperature :
245C (J-STD-020C Table 4-2: Packaging Thickness>=2.5mm /
Volume > 2000mm³),
Peak temperature over 245C is not suggested due to the
potential reliability risk of components under continuous high-
temperature.
Min. sustain duration above 217C : 90 seconds
Min. sustain duration above 180C : 150 seconds
Max. heat up rate: 3C/sec
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times reflow
requirement.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of 30°C and 60% relative humidity varies according
to the MSL rating (see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40° C, <
90% relative humidity.
Peak Temp. 240-245°C
217°C
200°C
150°C
Ramp down
max. 4°C/Sec
Preheat time
100-150 Sec.
Time Limited 90 Sec.
above 217°C
Ramp up
max. 3°C/Sec
25°C
Time
Figure 19. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability of
a power module and the testability of the finished circuit-board
assembly. For guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AP01-056EPS).
For additional information, please contact your Sales
representative for more details.
Pb-free Reflow Profile
BMP module will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both Pb-
free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended linear
reflow profile using Sn/Ag/Cu solder is shown in Figure 19.
MSL Rating
The modules have a MSL rating of 2a.
June 20, 2013
©2013 General Electric Company. All rights reserved.
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