HO60-P Datasheet, PDF (14/15 Pages) LEM – Current Transducer

PCB Footprint in mm.
HO 60 .. 250-P series
Assembly on PCB
●● Recommended PCB hole diameter

●● Maximum PCB thickness
●● Wave soldering profile
No clean process only
2.15 mm for primary pin
0.9 mm for secondary pin
2.4 mm
maximum 260 °C, 10 s
Insulation distance (nominal values):
On PCB: A - B
Between jumper and secondary pin
Between primary busbar and secondary pin
Between primary busbar and jumper
Between primary busbar and core
Between core and secondary terminal
d_Cp
18.85 mm
21.1 mm
14.6 mm
-
-
-
d_CI
-
20.9 mm
-
8 mm
11.34 mm
1.18 mm
16July2015/Version 5
LEM reserves the right to carry out modifications on its transducers, in order to improve them, without prior notice
Page 14/15
www.lem.com