CA064X104K4GACTU Datasheet, PDF (15/18 Pages) Kemet Corporation – Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
12 and 16 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Typical Pocket Centerline
Tape
Maximum
Width (mm)
Rotation (
°
T
)
Bo
8,12
20
16 – 200 10
Typical Component Centerline
Ao
Maximum Component Rotation
Side View
°
s
Tape
Maximum
Width (mm)
Rotation (
°
S
)
8,12
20
16 – 56 10
72 – 200 5
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
1.0 mm maximum
1.0 mm maximum
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 10/14/2016 15