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GWM120-0075X1 Datasheet, PDF (1/6 Pages) IXYS Corporation – Three phase full Bridge with Trench MOSFETs in DCB isolated high current package
Three phase full Bridge
with Trench MOSFETs
in DCB isolated high current package
GWM 120-0075X1
VDSS = 75 V
ID25
= 110 A
R = DSon typ. 4.0 mW
L+
G3
G5
G1
S3
S5
S1
L1
L2
L3
G4
G6
G2
S4
S6
S2
L-
MOSFETs
Symbol Conditions
VDSS
VGS
TVJ = 25°C to 150°C
ID25
TC = 25°C
ID90
TC = 90°C
IF25
TC = 25°C (diode)
IF90
TC = 90°C (diode)
Maximum Ratings
75 V
± 20
V
110 A
85 A
110 A
80 A
Symbol
RDSon
VGS(th)
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Eon
Eoff
Erecoff
RthJC
RthJH
Conditions
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
on chip level at
VGS = 10 V; ID = 60 A
VDS = 20 V; ID = 1 mA
VDS = VDSS; VGS = 0 V
VGS = ± 20 V; VDS = 0 V
TVJ = 25°C
TVJ = 125°C
TVJ = 25°C
TVJ = 125°C
VGS = 10 V; VDS = 36 V; ID = 25 A
VGS = 10 V; VDS = 30 V
ID = 80 A; RG = 39 Ω
inductive load
TVJ = 125°C
with heat transfer paste (IXYS test setup)
4.0
7.2
2
0.1
115
30
30
130
100
500
100
0.20
0.50
0.01
1.3
4.9 mW
8.4 mW
4
V
1 µA
mA
0.2 µA
nC
nC
nC
ns
ns
ns
ns
mJ
mJ
mJ
1.0 K/W
1.6 K/W
Straight leads
Surface Mount Device
Applications
AC drives
• in automobiles
- electric power steering
- starter generator
• in industrial vehicles
- propulsion drives
- fork lift drives
• in battery supplied equipment
Features
• MOSFETs in trench technology:
- low RDSon
- optimized intrinsic reverse diode
• package:
- high level of integration
- high current capability 300 A max.
- aux. terminals for MOSFET control
- terminals for soldering or welding
connections
- isolated DCB ceramic base plate
with optimized heat transfer
• Space and weight savings
Package options
• 2 lead forms available
- straight leads (SL)
- SMD lead version (SMD)
IXYS reserves the right to change limits, test conditions and dimensions.
© 2011 IXYS All rights reserved
20110407d
1-6