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IS43LD16640A Datasheet, PDF (89/143 Pages) Integrated Silicon Solution, Inc – Four-bit Pre-fetch DDR Architecture
IS43/46LD16640A
IS43/46LD32320A
Input Leakage Current
Parameter/Condition
Input Leakage current
Symbol
Min
Max
Unit Notes
For CA, CKE, CS_n, CK_t, CK_c
Any input 0V ≤ VIN ≤ VDDCA
IL
-2
2
uA 2
(All other pins not under test = 0V)
VREF supply leakage current
VREFDQ = VDDQ/2 or VREFCA = VDDCA/2
IVREF
-1
(All other pins not under test = 0V)
1
uA 1
Notes:
1. The minimum limit requirement is for testing purposes. The leakage current on VREFCA and VREFDQ pins should be minimal.
2. Although DM is for input only, the DM leakage shall match the DQ and DQS_t/DQS_c output leakage specification.
Operating Temperature Range
Parameter/Condition
Symbol
Min
Max
Unit
Standard
Extended
-40
TOPER
85
85
oC
105
oC
Notes:
1. Operating Temperature is the case surface temperature on the center/top side of the LPDDR2 device. For the measurement
conditions, please refer to JESD51-2 standard.
2. Some applications require operation of LPDDR2 in the maximum temperature conditons in the Extended Temperature Range
between 85°C and 105°C case temperature. For LPDDR2 devices, some derating is neccessary to operate in this range. See
MR4 on page 40.
3. Either the device case temperature rating or the temperature sensor (See “Temperature Sensor”) may be used to set an ap-
propriate refresh rate, determine the need for AC timing de-rating and/or monitor the operating temperature. When using the
temperature sensor, the actual device case temperature may be higher than the TOPER rating that applies for the Standard or
Extended Temperature Ranges. For example, TCASE may be above 85°C when the temperature sensor indicates a tempera-
ture of less than 85°C.
Thermal Resistance
Package
Substrate
134-ball BGA
168-ball PoP BGA
4-layer
4-layer
Theta-ja
(Airflow= 0m/s)
33.8
26.6
Theta-ja
(Airflow=1m/s)
28.1
22.0
Theta-ja
(Airflow=2m/s)
26.1
20.4
Theta-jc
4.0
3.8
Units
C/W
C/W
Integrated Silicon Solution, Inc. — www.issi.com
89
Rev. A
8/6/2014