IS61NLP25672 Datasheet, PDF (33/35 Pages) Integrated Silicon Solution, Inc – 256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM

PACKAGING INFORMATION
ISSI^®
Mini Ball Grid Array - 209 Ball BGA
Package Code: B (14 mm x 22mm Body, 1.0 mm Ball Pitch)
1 2 3 4 5 6 7 8 9 10 11
φ b (209X)
11 10 9 8 7 6 5 4 3 2 1
A
A
B
B
C
C
D
D
E
e
E
F
F
G
G
H
H
J
J
K
D D1
K
L
L
M
M
N
N
P
P
R
R
T
T
U
U
V
V
Y
Y
A1
SEATING PLANE
MILLIMETERS
A3
A2
A
INCHES
e
E1
E
Notes:
1. Controlling dimensions are in millimeters.
Sym. Min. Typ. Max.
N0.
Leads
209
Min. Typ. Max.
A
— — 1.95
— — 0.077
A1
0.40 0.50 0.60
0.016 0.020 0.024
A2
— 0.54 —
— 0.021 —
A3
0.65 0.70 0.75
0.026 0.028 0.030
D
21.90 22.00 22.10 0.862 0.866 0.870
D1
18.00 BSC
0.709 BSC
E
13.90 14.00 14.10 0.547 0.551 0.555
E1
10.00 BSC
0.394 BSC
e
1.00BSC
0.039BSC
b
0.50 0.60 0.70
0.020 0.024 0.028
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
08/22/03