IS62WV102416ALL Datasheet, PDF (16/17 Pages) Integrated Silicon Solution, Inc – 1M x 16 HIGH-SPEED LOW POWER ASYNCHRONOUS CMOS STATIC RAM

PACKAGING INFORMATION
Plastic TSOP - 48 pins
Package Code: T (Type I)
1
N
A
A1
E
b
e
D1
SEATING PLANE
D
Plastic TSOP (T - Type I)
Millimeters
Inches
Symbol Min Max Min Max
Ref. Std.
N
48
A — 1.20
— 0.047
A1 0.05 0.15 0.002 0.006
b 0.17 0.27 0.007 0.011
C 0.10 0.21 0.004 0.008
D 19.8 20.2 0.780 0.795
D1 18.2 18.6 0.716 0.732
E 11.8 12.2 0.464 0.480
e 0.50 BSC
0.020 BSC
L 0.50 0.70
α 0° 5°
0.020 0.028
0° 5°
Integrated Silicon Solution, Inc.
PK13197T48 Rev. B 07/17/97
L_α
C
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.