IS93C56A Datasheet, PDF (15/16 Pages) Integrated Silicon Solution, Inc – 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM

PACKAGING INFORMATION
150-mil Plastic SOP
Package Code: G, GR
N
EH
1
D
A
SEATING PLANE
A1
L
e
B
ISSI^®
α
C
150-mil Plastic SOP (G, GR)
Symbol Min Max
Min Max
Ref. Std.
Inches
mm
No. Leads
8
A
— 0.068
8
— 1.73
A1 0.004 0.009
0.1 0.23
B 0.013 0.020
C 0.007 0.010
0.33 0.51
0.18 0.25
D 0.189 0.197
4.8
5
E 0.150 0.157
H 0.228 0.245
3.81 3.99
5.79 6.22
e
0.050 BSC
1.27 BSC
L 0.020 0.035
0.51 0.89
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be
measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004 inches at the
seating plane.
Integrated Silicon Solution, Inc. — 1-800-379-4774
2
Rev. C
10/03/01