IS93C56A Datasheet, PDF (14/16 Pages) Integrated Silicon Solution, Inc – 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM

PACKAGING INFORMATION
300-mil Plastic DIP
Package Code: N,P
ISSI^®
N
E1
1
D
SEATING PLANE
S
S
B1
A
E
L
FOR
32-PIN ONLY
e
B
C
A1
B2
eA
MILLIMETERS
Sym. Min.
Max.
N0.
Leads
8
A
3.68
4.57
A1
0.38
—
B
0.36
0.56
B1
1.14
1.52
B2
0.81
1.17
C
0.20
0.33
D
9.12
9.53
E
7.62
8.26
E1
6.20
6.60
eA
8.13
9.65
e
2.54 BSC
L
3.18
—
S
0.64
0.762
INCHES
Min.
Max.
0.145
0.180
0.015
—
0.014
0.022
0.045
0.060
0.032
0.046
0.008
0.013
0.359
0.375
0.300
0.325
0.244
0.260
0.320
0.380
0.100 BSC
0.125
—
0.025
0.030
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should
be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004
inches at the seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
02/14/03