IS62LV256AL Datasheet, PDF (14/14 Pages) Integrated Silicon Solution, Inc – 32K x 8 LOW VOLTAGE CMOS STATIC RAM

PACKAGING INFORMATION
330-mil Plastic SOP
Package Code: U (28-pin)
N
ISSI^®
E1 E
1
D
S
SEATING PLANE
A
h x 45^o
e
L
B
A1
α
C
MILLIMETERS
Sym. Min. Max.
No. Leads 28
A
— 2.84
A1
0.10 —
B
0.36 0.51
C
0.25 —
D
17.98 18.24
E
11.51 12.12
E1
8.28 8.53
e
1.27 BSC
h
0.30 0.51
L
0.71 1.14
α
0^o
8^o
S
0.58 1.19
INCHES
Min. Max.
28
— 0.112
0.004 —
0.014 0.020
0.010 —
0.708 0.718
0.453 0.477
0.326 0.336
0.050 BSC
0.012 0.020
0.028 0.045
0^o
8^o
0.023 0.047
Notes:
1. Controlling dimension: inches, unless
otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should be
measured from the bottom of the
package.
4. Formed leads shall be planar with
respect to one another within 0.004
inches at the seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
02/26/03