IS61LV256AL Datasheet, PDF (13/13 Pages) Integrated Silicon Solution, Inc – 32K x 8 LOW VOLTAGE CMOS STATIC RAM

PACKAGING INFORMATION
Plastic TSOP - 28-pins
Package Code: T (Type I)
1
ISSI ^®
EH
N
D
S
SEATING PLANE
A
L
e
B
A1
α
C
Plastic TSOP (T—Type I)
Millimeters
Inches
Symbol Min Max
Min Max
Ref. Std.
No. Leads
28
A 1.00 1.20
0.037 0.047
A1 0.05 0.20
B 0.16 0.27
0.002 0.008
0.006 0.011
C 0.10 0.20
0.004 0.008
D 7.90 8.10
E 11.70 11.90
0.308 0.316
0.456 0.465
H 13.20 13.60
0.515 0.531
e
0.55 BSC
L
0.30 0.70
0.022 BSC
0.011 0.027
α
0°
5°
0°
5°
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and
should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within
0.004 inches at the seating plane.
Integrated Silicon Solution, Inc.
PK13197T28 Rev. B 01/31/97