IS62C1024AL Datasheet, PDF (11/11 Pages) Integrated Silicon Solution, Inc – 128K x 8 LOW POWER CMOS STATIC RAM

PACKAGING INFORMATION
Plastic TSOP-Type I
Package Code: T (32-pin)
1
ISSI^®
EH
N
D
SEATING PLANE
S
A
e
B
A1
L
α
C
MILLIMETERS
INCHES
Symbol Min. Max.
No. Leads
32
A
— 1.20
A1 0.05 0.25
B 0.17 0.23
C 0.12 0.17
D 7.90 8.10
E 18.30 18.50
H 19.80 20.20
e
0.50 BSC
L
0.40 0.60
α
0°
8°
S
0.25 REF
Min. Max.
— 0.047
0.002 0.010
0.007 0.009
0.005 0.007
0.311 0.319
0.720 0.728
0.780 0.795
0.020 BSC
0.016 0.024
0°
8°
0.010 REF
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
06/13/03