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IRF7759L2PBF_15 Datasheet, PDF (3/11 Pages) International Rectifier – Optimized for Synchronous Rectification | |||
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IRF7759L2PbF
Absolute Maximum Ratings
PD @TC = 25°C
PD @TC = 100°C
PD @TA = 25°C
TP
TJ
TSTG
f Power Dissipation
f Power Dissipation
c Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJ-Can
Parameter
e Junction-to-Ambient
j Junction-to-Ambient
k Junction-to-Ambient
fl Junction-to-Can
RθJ-PCB
Junction-to-PCB Mounted
Max.
125
63
3.3
270
-55 to + 175
Typ.
âââ
12.5
20
âââ
âââ
Max.
45
âââ
âââ
1.2
0.5
Units
W
°C
Units
°C/W
10
1
0.1
0.01
0.001
0.0001
1E-006
D = 0.50
0.20
0.10
0.05
0.02
0.01
ÏJ ÏJ
Ï1 Ï1
R1R1
R2R2
Ï2 Ï2
R3R3
Ï3 Ï3
R4R4
ÏCÏ
Ri (°C/W)
0.10804
0.61403
Ï4 Ï4
0.45202
Ïi (sec)
0.000171
0.053914
0.006099
SINGLE PULSE
( THERMAL RESPONSE )
Ci= Ïi/Ri
Ci i/Ri
0.00001 0.036168
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
1E-005
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case Â
Notes:
 Surface mounted on 1 in. square Cu board, steady state.
 Mounted on minimum footprint full size board with metalized
 TC measured with thermocouple incontact with top (Drain) of part. back and with small clip heatsink.
 Used double sided cooling, mounting pad with large heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
3
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February 24, 2014
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