IRF6648TR1 Datasheet, PDF (3/10 Pages) International Rectifier – RoHs Compliant Containing No Lead and Bromide

Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
h Power Dissipation
h Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
hj Junction-to-Ambient
ij Junction-to-Ambient
fj Junction-to-Case
Junction-to-PCB Mounted
IRF6648
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
–––
1.0
Max.
45
–––
1.4
–––
Units
W
°C
Units
°C/W
10
1
D = 0.50
0.20
0.10
0.1
0.05
0.02
0.01
0.01
0.001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
τ_{J τJ}
τ_{1 τ1}
R _{1R 1}
Ci= τi/Ri
Ci= τi/Ri
R_{2R 2}
τ_{2 τ2}
R_{3R 3}
Ri (°C/W) τi (sec)
τ_{CτC 0.17199 0.000044}
τ_{3 τ3}
0.67673 0.001660
0.54961 0.007649
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 1. Maximum Effective Transient Thermal Impedance, Junction-to-Case 
Notes:
† Surface mounted on 1 in. square Cu, steady state (still air).
‡ Used double sided cooling, mounted on 1 in. square Cu board
PCB with small clip heatsink (still air).
ˆ R_θ is measured at T_J of approximately 90°C.
Note †
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Note †
Note ‡
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