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IRFB7430PBF Datasheet, PDF (2/9 Pages) International Rectifier – HEXFETPower MOSFET | |||
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IRFB7430PbF
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
d Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
Pulsed Drain Current
PD @TC = 25°C
Maximum Power Dissipation
Linear Derating Factor
VGS
Gate-to-Source Voltage
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
EAS (Thermally limited)
EAS (tested)
IAR
EAR
e Single Pulse Avalanche Energy
k Single Pulse Avalanche Energy Tested Value
Ãd Avalanche Current
d Repetitive Avalanche Energy
Thermal Resistance
Symbol
Rï±JC
Rï±CS
Parameter
j Junction-to-Case
Case-to-Sink, Flat Greased Surface
Rï±JA
Junction-to-Ambient
Max.
409Â
289Â
195
1524
375
2.5
± 20
-55 to + 175
300
x x 10lbf in (1.1N m)
760
1360
See Fig. 14, 15, 22a, 22b
Typ.
âââ
0.50
âââ
Max.
0.40
âââ
62
Units
A
W
W/°C
V
°C
mJ
A
mJ
Units
°C/W
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
V(BR)DSS
ïV(BR)DSS/ïTJ
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
IDSS
Gate Threshold Voltage
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
RG
Internal Gate Resistance
Min.
40
âââ
âââ
âââ
2.2
âââ
âââ
âââ
âââ
âââ
Typ.
âââ
0.014
1.0
1.2
âââ
âââ
âââ
âââ
âââ
2.1
Max.
âââ
âââ
1.3
âââ
3.9
1.0
150
100
-100
âââ
Units
Conditions
V
V/°C
mï
V
μA
nA
ï
VGS = 0V, ID = 250μA
d Reference to 25°C, ID = 1.0mA
g VGS = 10V, ID = 100A
g VGS = 6.0V, ID = 50A
VDS = VGS, ID = 250μA
VDS = 40V, VGS = 0V
VDS = 40V, VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
Notes:
 Calculated continuous current based on maximum allowable junction Â
Pulse width ï£ 400μs; duty cycle ï£ 2%.
temperature. Bond wire current limit is 195A. Note that current
 Coss eff. (TR) is a fixed capacitance that gives the same charging time
limitations arising from heating of the device leads may occur with
as Coss while VDS is rising from 0 to 80% VDSS.
some lead mounting arrangements. (Refer to AN-1140)
 Repetitive rating; pulse width limited by max. junction
temperature.
 Limited by TJmax, starting TJ = 25°C, L = 0.15mH
 Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
 Rï± is measured at TJ approximately 90°C..
 This value determined from sample failure population,
RG = 50ï, IAS = 100A, VGS =10V.
 ISD ï£ 100A, di/dt ï£ 990A/μs, VDD ï£ï V(BR)DSS, TJ ï£ 175°C.
starting TJ = 25°C, L= 0.15mH, RG = 50ï, IAS = 100A, VGS =10V.
2
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