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IRF7343QPBF Datasheet, PDF (1/10 Pages) International Rectifier – HEXFET Power MOSFET
PD - 96110
l Advanced Process Technology
l Ultra Low On-Resistance
S1
l Dual N and P Channel MOSFET
l Surface Mount
G1
l Available in Tape & Reel
S2
l 150°C Operating Temperature
l Automotive [Q101] Qualified
G2
l Lead-Free
Description
Specifically designed for Automotive applications, these
HEXFET® Power MOSFET's in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET's are a
150°C junction operating temperature, fast switching
speed and improved repetitive avalanche rating. These
benefits combine to make this design an extremely efficient
and reliable device for use in Automotive applications and
a wide variety of other applications.
The efficient SO-8 package provides enhanced thermal
characteristics and dual MOSFET die capability making it
ideal in a variety of power applications. This dual, surface
mount SO-8 can dramatically reduce board space and is
also available in Tape & Reel.
Absolute Maximum Ratings
VDS
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 70°C
EAS
IAR
EAR
VGS
dv/dt
TJ, TSTG
Parameter
Drain-Source Voltage
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current 
Maximum Power Dissipation …
Maximum Power Dissipation …
Single Pulse Avalanche Energyƒ
Avalanche Current
Repetitive Avalanche Energy
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ‚
Junction and Storage Temperature Range
IRF7343QPBF
HEXFET® Power MOSFET
N-CHANNEL MOSFET
1
8
2
7
3
6
4
5
P-CHANNEL MOSFET
Top View
N-Ch P-Ch
D1
D1
VDSS
D2
55V
-55V
D2
RDS(on) 0.050Ω 0.105Ω
SO-8
Max.
N-Channel
P-Channel
55
-55
4.7
-3.4
3.8
-2.7
38
-27
2.0
1.3
72
114
4.7
-3.4
0.20
± 20
5.0
-5.0
-55 to + 150
Units
V
A
W
W
mJ
A
mJ
V
V/ns
°C
Thermal Resistance
Parameter
RθJA
Maximum Junction-to-Ambient …
www.irf.com
Typ.
–––
Max.
62.5
Units
°C/W
1
07/23/07