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| HCTS193MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Synchronous 4-Bit Up/Down Counter | |||
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS193MS
HCTS193MS
Q1
P1
VCC
(2)
(1)
(16)
Q0(3)
CPD(4)
CPU(5)
Q2(6)
(15) P0
(14) MR
(13) TCD
(12) TCU
Q3(7)
(11) PL
(8)
(9)
(10)
GND
P3
P2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS193 is TA14451A.
Spec Number 518620
600
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